Cooler Master RG-ICFN-200G-B1 IceFusion 200G Thermal Compound
Cooler Master RG-ICFN-200G-B1 IceFusion 200G thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. With enhanced thermally conductive non-curing compound, IceFusion provides excellent performance and stability. It is optimized for use between CPUs, and heatsinks or water-cooling solutions.

What it is & Why You Need it:

• High thermal conductivity.


• Low thermal resistance.


• Non-corrosive.


• Best thermal stability in high temperature.


• Excellent adhesion.


• Preserve in room temperature for longer lifespan.


• Up to 500 applications